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Wednesday, October 7, 2009

Intel's "Core i9" Gulftown heat sink is the vertical

Say goodbye to the flawed push-pin design

Society 32nm six core beast Gulftown many call the "Core I9" a redesigned heat sink, moving from top-mounted installation of the fan blades in a vertical design that is warm air to flow out from the back of the frame.

Last week the Forum Intel IDF in San Francisco, California, which was to last many interesting surprises for industry computer programmers, analysts, consumers and aggregate a wide range of Industries. Mboilgeog consumers enthusiastically the most of our readers are worried about that often, Intel PR team is working 22nm Sandy Bridge chips, and a new heatsink design for the upcoming major flagship edition LGA processor 1366 in 2010.

Intel engineer must also change the abysmal pin design with threaded screw design that use any other manufacturer with a heat sink. This is, of course, a heat sink with a company growing security and durability.

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