Work DFI motherboard ION/P45 Hybrid

Two systems on a single PCB

Almost all major manufacturer, and intends using the Nvidia product ion, but every time a card atom ion, ion-based Netbook and nettops. DFI in a very unique solution is that some ion Nvidia, Intel P45 chipset, and still very unique way. P45-ion hybrid circuit T2A2 actully Motherboard, only two systems.

The most interesting part is that these two systems can operate either in a joint operation or totally independent of each other. Shared by these two systems, a number of I / O ports and others have been deliberately for a particular system.

The left side of the motherboard is all about NVIDIA ION paired with Intel Atom CPU, while the right side based on Intel P45 chipset. Motherboard is equipped with a PCI-Express x16, one PCI-Express x1 and two PCI slots used.

It looks like an interesting concept, but the price U.S. $ 399 may be a bit harsh. Since the motherboard is still at the concept stage, much can change, so let's see what DFI can not be helped.

Zotac shows its new ION-ITX motherboard

Zotac has released a new Mini-ITX Motherboard primary ion NVIDIA platform, Ion ITX-F. Nettop love this part of the equipment features based Dual-1.6GHz Atom 330 processor and NVIDIA 9400 GPU ION.

ZOTAC it even managed to squeeze in a PCI-Express x16, if you use the GeForce 9400 GPU ION find little too slow for your taste. The motherboard looks like a winner, when you build a low-end HTPC system. As you know, ION is able to manage 1080p content, and from the reports that so far, it might have a future with a Flash-based content as well.

New ZOTAC ION F-ITX motherboard, available in the coming weeks with a € 139 price. This is of course the price proposed, and some may sell fewer e-tailers/retailers.

Kingston Rambus team of more than 50% faster DDR3

Kingston has joined forces with Rambus to create a new DDR3 prototype, which is a memory module suitable for multi-threaded multi-core computers. Optimization modules allegedly led to a 50% increase in performance on the current DDR3 modules.

The requirement for business energy consumption has been reduced by 20%, which is a new circuit is much more efficient and should not be active more often than the current one as well.

Rambus does not say much, although many people want to know the compatibility with the current culture of DDR3 motherboards, but the company has more bits at some point in the coming weeks, so stay tuned.

Dual Core for 670 soldiers î5 sell for $ 284

The fastest of them going to the desktop until the end of the stamp Core i5 670 and Clarkdale 32nm processor will sell enough to copy a realistic $ 284. This wholesale price index of 1000 units, but the proposed price is unlikely to be far away.

2010 Q1, although it may be January, Intel unveiled Hyperthreading support, and one in Clarkdale and Arrandale 32nm dual-core with integrated IGP core 45nm CPUs.

Because these processors support the Turbo, you will be faster than 3.46GHz. CPU cache is 4 MB and socket LGA1156. 65nm and 45nm versions of this order and the gradual retirement expenses, Core 2 Duo generation seems to be a good backup.

Dual Core for 670 soldiers î5 sell for $ 284

The fastest of them going to the desktop until the end of the stamp Core i5 670 and Clarkdale 32nm processor will sell enough to copy a realistic $ 284. This wholesale price index of 1000 units, but the proposed price is unlikely to be far away.

2010 Q1, although it may be January, Intel unveiled Hyperthreading support, and one in Clarkdale and Arrandale 32nm dual-core with integrated IGP core 45nm CPUs.

Because these processors support the Turbo, you will be faster than 3.46GHz. CPU cache is 4 MB and socket LGA1156. 65nm and 45nm versions of this order and the gradual retirement expenses, Core 2 Duo generation seems to be a good backup.

Intel's "Core i9" Gulftown heat sink is the vertical

Say goodbye to the flawed push-pin design

Society 32nm six core beast Gulftown many call the "Core I9" a redesigned heat sink, moving from top-mounted installation of the fan blades in a vertical design that is warm air to flow out from the back of the frame.

Last week the Forum Intel IDF in San Francisco, California, which was to last many interesting surprises for industry computer programmers, analysts, consumers and aggregate a wide range of Industries. Mboilgeog consumers enthusiastically the most of our readers are worried about that often, Intel PR team is working 22nm Sandy Bridge chips, and a new heatsink design for the upcoming major flagship edition LGA processor 1366 in 2010.

Intel engineer must also change the abysmal pin design with threaded screw design that use any other manufacturer with a heat sink. This is, of course, a heat sink with a company growing security and durability.

Arrandale come early next year

He even said it is good to have the graphics processor socket is the same, noting that the turbo can help give more revenue depends on the graphics processor or two cool.

Intel Vice Didi Perlmutter Arrandale are listed in the IDF. The complex dual-core graphics chipset and considering starting next year.

It makes sense that Intel's first step for the Holy Grail of a combination of graphics on the processor makes communication faster chips. It happens with Intel chips, but I hope that in coming years with the new core in Larrabee.

Fusion is the way, and I know that is Intel, but I do not want to talk about it in 2006 when they knew that they had received IGP in the CPU, at least before 2010 or late 2009.